[share_ebook] Materials for High-Density Electronic Packaging and Interconnection - Committee On Materials For High-Density Electronic Packaging


Author: Committee On Materials For High-Density Electronic Packaging

Date: January, 1990

Pages: 156

Publisher: National Academies Press

Category: Technical


Posted on 2012-01-11, by 4bookholic.

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Materials for High-Density Electronic Packaging and Interconnection


Materials for High-Density Electronic Packaging and Interconnection
Committee On Materials For High-Density Electronic Packaging | National Academies Press | January, 1990 | 156 pages | English | PDF

What is packaging? The subject of this report is commonly referred to as electronic packaging, but the term '"packaging" carries connotations that tend to trivialize the highly technical and critically important electronic context. Electronic packaging now goes well beyond physical protection and includes electric power distribution, signal transmission between integrated circuits, and, of growing importance, the removal of heat associated with the very high densities of circuit elements that are being achieved. Modern system performance is as much limited by these functions as by the operation of the integrated circuits.


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